MonolithIC 3D Inc., a Finalist at Semicon West 2011, Announces its Return to the 2012 Event

San Jose, CA (PRWEB) May 31, 2012

Mono­lithIC 3D Inc., a Silicon Valley startup, announced that it will partic­ipate for the second year in a row at Semicon West 2012 exhibiting its products that enable prac­tical paths to mono­lithic 3D IC tech­nology. The company was selected as a Finalist of the Best of Semicon West 2011 for its disruptive tech­nology. Besides logic struc­tures, these mono­lithic 3D tech­nologies include DRAM, NAND Flash and RRAM memory types, FPGA and gate arrays, as well as methods of fabri­cating image sensors and micro-displays. This year Mono­lithIC 3D Inc. announces new products at the exhibit.

We are pleased to partic­ipate again in this major industry show. We will present the funda­mental mono­lithic 3D tech­nology break­through along with a set of detailed imple­men­ta­tions of mono­lithic 3D tech­nology for specific market segments of the industry. For this year we will present a tech­nology deriv­ative that targets the embedded memory chal­lenge of SoC. This new deriv­ative utilizes the 3D archi­tecture advantage for hetero­ge­neous inte­gration to achieve signif­icant cost reduction, stated Zvi Or-Bach, Mono­lithIC 3Ds founder and CEO. We are looking forward to meeting partners and potential users and for the oppor­tunity to present the power of mono­lithic 3D for the future of the semi industry.

It is clear that further feature size scaling will be difficult, expensive, and will not provide as much benefit as before, notes Mono­lithIC 3Ds VP of Tech­nology & IP Brian Cron­quist. 3D IC is coming of age, yet the TSV version is fraught with tech­nical chal­lenges and cost issues. Mono­lithic 3D, with its high density of small via-like vertical connec­tions, provides a natural path to maintain the benefits of scaling and avoid the upcoming brick walls in the tradi­tional scaling roadmap.

The companys patented 3D tech­nologies offer chip­makers an economical and prac­tical way to create mono­lith­i­cally inte­grated three-dimensional circuits. Mono­lithIC 3D Inc.s concepts have the potential to maintain or increase device speed and lower power require­ments for a given node, while avoiding the need for continuous (and very costly) dimen­sional scaling that has been the basis for Moores Law. Brief tech­nical disclo­sures and brochures of all mono­lithic 3D tech­nologies are available at the companys website and at the Semi­conWest show on July 10–12, 2012, at Moscone Center booth #6775.

About Mono­lithIC 3D Inc.

Mono­lithIC 3D Inc. is an IP company with more than 50 issued and pending patents, dedi­cated to inno­vation in semi­con­ductor design and fabri­cation. It invented and developed a prac­tical path to the mono­lithic 3D Inte­grated Circuit, which includes multiple deriv­a­tives for Logic, Memory and Electro Optic devices. Mono­lithIC 3D Inc.s business model includes licensing tech­nology to existing semi­con­ductor manu­fac­turers. More infor­mation about the company, including detailed tech­nical infor­mation, can be found at its website.